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Microstrip patch antenna miniaturization using artificial magnetic conductor
Rahmadani F.a, Munir A.a
a Radio Telecommunication and Microwave Laboratory, School of Electrical Eng. and Informatics, Institut Teknologi Bandung, Indonesia
[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]This paper deals with an alternative technique for microstrip patch antenna miniaturization is investigated. The technique employs a 2 layer structures with an artificial magnetic conductor (AMC) structure used as the bottom layer replacing the ground plane. The AMC structure is constructed using a textured high impedance surface (HIS) that takes form of a doubly periodic square patches on top of a dielectric substrate. The miniaturization effect that is introduced especially in the reduction of patch size by use of this 2 layer structures will be numerically investigated. The proposed antenna is designed to have a resonant frequency of 2.45MHz suitable for wireless local area network (WLAN) application and is deployed on an FR-4 Epoxy substrate. To obtain the optimum design, numerical analysis is carried out using 3D simulation software. To verify the miniaturization effect, the proposed antenna will be compared to some reference antenna resonates at the same resonant frequency placed on a 2 layers FR-4 Epoxy substrate with the same thickness but without AMC structure. From the result, it is shown that the incorporation of AMC structure can reduce the size of antenna patch by more than 31%. © 2011 IEEE.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text]2 layer,3D simulations,Artificial magnetic conductors,Bottom layers,Dielectric substrates,Doubly periodic,Ground planes,High-impedance surfaces,Magnetic conductors,Micro-strip patch antennas,microstrip patch antenna,Optimum designs,patch miniaturization,Patch size,Reference antennas,Size reductions,Wireless local area network applications[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Artifical magnetic conductor,microstrip patch antenna,patch miniaturization,size reduction[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.1109/TSSA.2011.6095438[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]