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Enhancement performance of dye-sensitized solar cells from black rice as dye and black ink as counter electrode with inserting copper on the space between TiO2 particles by using electroplating method

Yuliza E.a, Saehana S.a, Rahman D.Y.a, Rosi M.a, Khairurrijala, Abdullah M.a

a Physics of Electronic Materials Research Division, Faculty of Mathematics and Natural Sciences, Institut Teknologi Bandung, Indonesia

[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]In this study, we report well performance of Dye Sensitized Solar Cell (DSSC) coated with copper (Cu) particles by using the electroplating method. The Cu particles were impregnated into the pore of the titanium dioxide (TiO2) thin film. Particle contact between Cu and TiO2 plays important role to reduce the recombination effect of the electron and also lead to increase the electron transport in the DSSC. Here, we used natural dye extracted from black rice and carbon from black inks as counter electrode. It is found that the efficiency of the DSSC with Cu particles is 0.105%, which is higher than that of pure DSSC (0.019%) as obtained from I-V characterization. In addition, the internal resistance of the DSSC with Cu particles was lower as measured by Electrochemical Impedance Spectroscope (EIS). © (2013) Trans Tech Publications, Switzerland.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text]DSSC,Electrochemical impedance,Electron transport,Internal resistance,IV characterization,Natural dye,Schottky junctions,Titanium dioxides (TiO2)[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Carbon,DSSC,Efficiency,Electroplating,Internal resistance,Natural dye,Schottky junction[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.4028/www.scientific.net/MSF.737.85[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]