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Modeling and analysis of VIA effect to LD-MOSFET RF amplifier performance

Alam B.R.a

a Electronics Research Group, School of Electrical Engineering and Informatics, Institute of Technology Bandung, Labtek VIII Building, Bandung, 40132, Indonesia

[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]© 2015 IEEE.Modeling of VIA as additional extrinsic elements to LD MOSFET model utilized as a pre-amplifier of a 45dBm LIE front-end has been simulated and characterized in 1.8GHz LTE band. The RF gain performance degradation of the LD-MOSFET pre-amplifier has been verified through the simulation using modified array of shunt inductance network and verified experimentally by S-parameter measurement on some VIA structures with various dimension and PCB manufacturing arrangement. The Via effect to RF S-parameter and gain performance of the 1.8GHz pre-amplifier and over-all front-end has been fitted and analyzed. RF PCB manufacturing process aiming VIA manufacturing quality has been endorsed as a result of RF gain performance verification.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Gain performance,Manufacturing quality,Model and analysis,MOSFET modeling,Pcb manufacturing,RF amplifiers,S-Parameter measurements,Shunt inductance[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.1109/EDSSC.2015.7285142[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]