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Performance Improvement of TiO2/CuO Solar Cell by Growing Copper Particle Using Fix Current Electroplating Method
Rokhmat M.a,b, Wibowo E.a,b, Sutisnaa, Khairurrijala, Abdullah M.a
a Bandung Institute of Technology, Bandung, Indonesia
b Telkom University, Bandung, Indonesia
[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]© 2017 The Authors.Here, we report the efficiency enhancement of TiO2/CuO/Cu/PVA.LiOH/Al solar cell by growing copper particles on the space between TiO2 and/or CuO particles. The TiO2/CuO film was developed by spraying process of TiO2/CuO suspension to the Fluorin doped Tin Oxide (FTO), while copper particles were grown by fix current electroplating as our proposed method. We found the highest efficiency and fill factor was 1.62% and 0.42, respectively. This result is higher than by using fix voltage electroplating (ordinary electroplating) as we reported in a previous paper. We suspect that the presence and the optimum amount of copper particles can improve efficiency and fill factor of the solar cells because it can facilitate the transporting process of electrons to the electrode. The effect of the magnitude of the current and time of electroplating is also investigated. The highest efficiency is obtained by using electroplating current of 10 mA for 20 seconds, which gives the amount of copper content of 7.6%. It indicates that the copper content of this magnitude is sufficient to improve the transport of electrons.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Copper content,Copper particles,Doped tin oxides,Efficiency enhancement,Fill factor,Fluorin,Space between,Spraying process[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text]fix current electroplating,solar cell,spray,TiO2[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.1016/j.proeng.2017.03.014[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]