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Printed traveling wave antenna with vertical transition for wireless communications

Chairunnisaa, Trisondra E.a, Maurizka A.a, Munir A.a

a Radio Telecommunication and Microwave Laboratory School of Electrical Engineering and Informatics, Institut Teknologi Bandung, Indonesia

[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]© 2018 Electromagnetics Academy. All rights reserved.In this paper, the development and characterization of printed traveling wave antenna with vertical transition is investigated. The antenna which is intended for wireless communications application consists of microstrip lines on the bottom layer interconnected with radiating elements on the top layer using via holes act as vertical transitions. The groundplane is positioned between the microstrip lines and radiating elements with slot-etched in the part of via-holes transition. Two layers of 0.8 mm thick FR4 Epoxy dielectric substrate are used for deploying the proposed antenna with the overall size of 32 mm × 38 mm. From the characterization, it shows that the measured results have good agreements qualitatively with the simulated ones. The fractional bandwidth for reflection coefficient less than −10 dB is about 19.5% with the minimum reflection coefficient up to −60.8 dB at its resonant frequency.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Bottom layers,Dielectric substrates,Fractional bandwidths,Measured results,Radiating elements,Top layers,Vertical transitions,Wireless communications[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.1109/PIERS-FALL.2017.8293592[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]