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Effect of annealing treatment on sputtered copper oxide thin film
Sangwaranatee N.a, Horprathum M.b, Chananonnawathorn C.b, Hendroc
a Applied Physics, Faculty of Science and Technology, Suan Sunandha Rajabhat University, Bangkok, 10300, Thailand
b Optical Thin-Film Laboratory, National Electronics and Computer Technology Center, Pathumthani, 12120, Thailand
c Faculty of Mathematics and Natural Sciences, Institut Teknologi Bandung, 40132, Indonesia
[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]© 2018 Elsevier Ltd. All rights reserved.Copper oxide thin films were prepared on silicon wafer and glass slide substrate by dc reactive magnetron sputtering using a copper target without substrate heating. As-deposited CuO thin films were then annealed at various the temperatures in air ambient. The effects of annealing treatment on the physical morphology, optical property of the prepared samples were studied by glancing incident X-ray diffraction (GIXRD), field-emission scanning electron microscopy (FE-SEM), UV-Vis-NIR spectrophotometer. The results shown that the crystallinity of the CuO thin films was significantly improved as an annealing temperature increased. Additionally, the sheet resistance measurements were characterized on as-deposited and annealed samples in order to discuss the electrical properties.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Copper oxide,DC sputtering,Morphology,Operating pressure[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text]This work was supported by Applied Physics, Faculty of Science and Technology, Suan Sunandha Rajabhat University and Faculty of Mathematics and Natural Sciences, Institut Teknologi Bandung, Indonesia. Authors were grateful to National Electronic and Computer Technology Center (NECTEC) for the instrumental support of the instrument of deposition and characterization systems.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.1016/j.matpr.2018.04.077[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]