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Identifying best parameters of particleboard bonded with dextrin-based adhesives
Alamsyah E.M.a, Sutrisnoa, Nuryawan A.b, Widyorini R.c
a Department of Post Harvest Technology, School of Life Sciences and Technology, Institut Teknologi Bandung, Bandung, Indonesia
b Department of Forest Products Technology, Faculty of Forestry, Universitas Sumatera Utara, Medan, Indonesia
c Department of Forest Products Technology, Faculty of Forestry, Gadjah Mada University, Yogyakarta, Indonesia
[vc_row][vc_column][vc_row_inner][vc_column_inner][vc_separator css=”.vc_custom_1624529070653{padding-top: 30px !important;padding-bottom: 30px !important;}”][/vc_column_inner][/vc_row_inner][vc_row_inner layout=”boxed”][vc_column_inner width=”3/4″ css=”.vc_custom_1624695412187{border-right-width: 1px !important;border-right-color: #dddddd !important;border-right-style: solid !important;border-radius: 1px !important;}”][vc_empty_space][megatron_heading title=”Abstract” size=”size-sm” text_align=”text-left”][vc_column_text]© 2020 Eka Mulya Alamsyah et al.The objective of this study was to evaluate the best parameters of particleboard manufacturing throughout the physical and mechanical properties’ test under Japanese Industrial Standard. Particleboard panels were manufactured from veneer waste of sengon wood (Paraserianthes moluccana) bonded with dextrin-based adhesives (DAs) and urea formaldehyde (UF) adhesives at the density target of 0.70 g/cm2 under various manufacturing parameters of adhesives composition, load pressure and pressure temperatures. The results showed that an increase in the value of physical and mechanical properties occurred on particleboards which were glued with DAs added with UF. As the addition of UF adhesive increases, the physical and mechanical properties of the particleboard also gradually increase. This confirms that a good bonding occurs when adding UF adhesives compared to using only dextrin. The particleboard manufacturing parameters demonstrated the best properties when 40% DA was mixed with 60% UF adhesives (DA–UF = 40:60 pbw; P12) for the physical test and 20% DA mixed with 80% UF (DA–UF = 20:80; P13) for the mechanical test for both particleboards under the load pressurized at 40 kgf/cm2 for 30 min at a temperature of 105°C.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Author keywords” size=”size-sm” text_align=”text-left”][vc_column_text][/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Indexed keywords” size=”size-sm” text_align=”text-left”][vc_column_text]Adhesives,Dextrin,Particleboard bonded[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”Funding details” size=”size-sm” text_align=”text-left”][vc_column_text]The authors would like to thank the Lembaga Pengabdian Pada Masyarakat Institut Teknologi Bandung (LPPM ITB) for their financial support during the research period under the scheme of Program Penelitian Kolaborasi Indonesia (PPKI) research grant 2019. The authors would also like to appreciate PT. Sumber Graha Sejahtera in Balaraja Tangerang, Indonesia for their research equipment and assistance.[/vc_column_text][vc_empty_space][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][vc_empty_space][megatron_heading title=”DOI” size=”size-sm” text_align=”text-left”][vc_column_text]https://doi.org/10.1515/opag-2020-0037[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/4″][vc_column_text]Widget Plumx[/vc_column_text][/vc_column_inner][/vc_row_inner][/vc_column][/vc_row][vc_row][vc_column][vc_separator css=”.vc_custom_1624528584150{padding-top: 25px !important;padding-bottom: 25px !important;}”][/vc_column][/vc_row]